Global Principal Program Manager, Tool Install - Semiconductors

9529 Posted: 16/06/2026

Competitive
Idaho, United States
Semiconductor
Permanent

_{Global Facilities Principal Program Manager, Tool Install - Semiconductors}

We are working with a world-leading semiconductor technology company to identify a Principal Program Manager for their Global Facilities Tool Installation team. This is one of the most senior and strategically significant programme management roles within the organisation — sitting at the intersection of global facilities engineering, greenfield fab construction, and manufacturing operations.
The Global Facilities Tool Installation team leads the planning, development, construction, and operation of a worldwide manufacturing network. This team drives major global programmes that integrate engineering innovation, sustainability, and operational excellence to enable advanced semiconductor manufacturing at scale.
This is a principal-level role designed for a highly experienced professional with a strong facilities and greenfield construction background who thrives in complex, fast-paced environments and excels at collaboration, data-driven decision-making, and continuous improvement. If you have led Tool Installation programmes at a major semiconductor fab or tier-1 contractor, this is a rare opportunity to take that experience to a global stage.

Key Responsibilities

Lead U.S. Facilities Tool Installation efforts for new fab startups and greenfield expansions, including planning and development of Tool Install User Requirement Specifications (TI-URS).
Partner with Global Procurement and site teams on TI RFPs, supporting contracting strategies, bid evaluations, cost modelling, and execution timelines.
Ensure global project readiness by coordinating material planning, labour strategies, construction interfaces, and risk identification and resolution.
Develop and maintain installation benchmarks to identify opportunities for cycle-time reduction and critical path optimisation.
Define and implement global TI strategies and transformation roadmaps, including standardisation and digital enablement initiatives.
Deliver executive-level reporting, analytics, and insights to support decision-making and risk management across senior leadership.
Support cost visibility, budgeting processes, and adoption of project management systems to ensure data consistency and alignment across sites.
Minimum Qualifications
Bachelor's or Master's degree in Engineering, Construction Management, Project Management, or a related field.
10+ years of experience in semiconductor wafer fabrication facilities, preferably in 300mm (12") environments.
Strong knowledge of facilities tool installation, cleanroom operations, and system integration with manufacturing equipment.
Ability to collaborate globally, including flexibility to work across time zones and travel up to 10%.
Preferred Qualifications
Experience working in global, multi-functional environments with suppliers, contractors, and senior stakeholders.
Familiarity with tools such as AutoCAD, Revit, Power BI, Tableau, or similar engineering and analytics platforms.
Strong communication, organisational, and stakeholder management skills.
Demonstrated ability to manage multiple priorities independently and drive continuous improvement initiatives.
Why This Role?
Principal-level scope with genuine global reach — your strategies and BKMs will be implemented across international fab sites, not just one location.
Work on one of the most ambitious semiconductor greenfield expansion programmes underway in the United States today.
Rare opportunity to move from execution-level TI management into a strategic, cross-functional leadership role with executive visibility.
Highly competitive compensation package at the top of the market for principal-level programme management talent.
Collaborative culture with a lean, high-performing team where your contribution is visible and valued.