Packaging Engineer - Power

8830 Posted: 27/08/2025

Competitive
Malaysia
Semiconductor
Permanent

Job Title: Packaging Engineer

Job Overview:
Our client is seeking an experienced and motivated Packaging Engineer to join a dynamic global team. This role provides an opportunity to collaborate with industry-leading professionals, driving innovation and optimizing semiconductor packaging solutions. You will play a key role in advancing high-volume manufacturing capabilities, improving process efficiency, and contributing to the development of cutting-edge technologies.

Key Responsibilities:

Process Optimization: Establish and optimize robust, high-speed process parameters for various component attachment processes, stack-up configurations, and molding technologies (including transfer and compression molding).
Manufacturing Process Design: Define and streamline manufacturing process sequences for different component attachment methods.
Product Execution Management: Lead the execution of multiple new product development projects from initial kick-off, product prototyping, characterization, learning cycles, and qualifications to final product release (RTM), ensuring proper project documentation at every stage.
Collaboration with Operations Teams: Work closely with factory operations teams to ensure alignment with manufacturing targets, quality standards, and cost objectives.
Technology Roadmap Execution: Partner with global platform teams and emerging technology groups to implement differentiated technology roadmaps and establish process capabilities that meet future needs.
Competitiveness Enhancement: Drive the adoption of industry-leading technologies to maintain the competitiveness of packaging solutions in a high-volume manufacturing environment.

Minimum Qualifications:

Education: Bachelor’s degree in Mechanical Engineering, Physics, Material Science, or a related field.
Experience: A minimum of 8 years of experience in the semiconductor industry, with expertise in packaging engineering.
Module Packaging Expertise: Experience in module package design and stack-up configuration, with expertise in package layer design, material selection, and process flow design.
Process Development Expertise: Extensive experience in full-process development for Surface-Mount Technology (SMT), including flip chip, underfill, and component attachment, as well as backend packaging processes such as mold/package singulation, package saw, and trim & form.
Hands-on Skills: Practical experience in operating packaging machinery, material down-selection, and process optimization to improve yield and efficiency.

Preferred Qualifications:

Advanced Process Knowledge: Experience with Flip Chip, Chip Shooter, and Underfill processes is highly preferred.
Molding and System-in-Package Expertise: Additional experience in Mold, Package Saw, Trim & Form, and System-in-Package processes is a plus.
EOL Process Knowledge: Familiarity with IC packaging End-of-Line (EOL) processes and Design for Manufacturability (DFM) principles.
Multi-process Coordination: Experience in coordinating and optimizing multi-process workflows, particularly in the integration between SMT and back-end packaging processes.

Location: Malaysia

This is an exciting opportunity to join a leading company and contribute to the next generation of semiconductor packaging technologies. If you are passionate about process optimization and working in a fast-paced, innovative environment, we invite you to apply.