Senior Engineer – Power Magnetics & Module Design | MRL Consulting
- Competitive
- Germany
- Semiconductor
- Permanent
Senior Engineer – Power Magnetics & Module Design
We are recruiting on behalf of a leading global technology organisation for a Senior Power Magnetics & Module Design Engineer to develop high-density, high-frequency power solutions for next-generation processors and data centre applications.
This role offers the opportunity to work across advanced power electronics, magnetics, packaging and power delivery architectures.
Key Responsibilities
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Design and optimise magnetics for package- and board-level DC-DC converters, focusing on efficiency, footprint and thermal performance.
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Develop Point-of-Load (PoL), IVR/VRM and isolated DC-DC power modules.
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Design advanced power module architectures, including 3D stacking and PCB/substrate-embedded magnetics.
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Perform electromagnetic, thermal and mechanical modelling and FEA simulations.
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Collaborate with prototype teams and suppliers to develop and validate designs.
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Develop simulation tools and automated workflows to improve design efficiency.
Key Requirements
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Master’s or PhD in Electrical Engineering, Microelectronics, Materials Science or a related discipline, ideally with a focus on integrated power electronics.
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Strong industry experience in power magnetics, power modules and data centre power systems.
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Proven experience designing high-frequency package-, board- and system-level power delivery architectures.
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Expertise in high-density inductors and planar transformers, including LLC and HSC topologies.
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Strong knowledge of advanced packaging and PCB/substrate-embedded magnetics manufacturing.
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Experience with Silicon/LV GaN and electrical, thermal and mechanical modelling.
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Knowledge of high-frequency magnetic materials, loss modelling and reliability testing, particularly at 5MHz+.
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Experience with FEM multi-physics simulation tools such as COMSOL.
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Strong analytical, problem-solving and innovative thinking skills.
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Fluent written and spoken English.
What’s on Offer
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Opportunity to work on next-generation power electronics and advanced packaging technologies.
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International, collaborative working environment with extensive knowledge sharing.
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Comprehensive training and professional development opportunities, including language courses.
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High degree of autonomy within a highly skilled and growing team.