GaN Process & Device Architect

9013
  • Per Day Competitive
  • Netherlands
  • Semiconductor
  • Permanent
GaN Process & Device Architect – RF Power Technologies

Location: Netherlands
Type: Full-time | R&D

Are you an expert in GaN-on-SiC technology and passionate about shaping the future of high-power RF applications? We’re looking for a GaN Process & Device Architect to lead next-generation technology architecture, device design, and process integration.


What You’ll Do

  • Define and lead GaN/SiC HEMT technology architecture and process development
  • Drive innovation in device physics, reliability physics, TCAD simulation, and characterization
  • Collaborate with epitaxy and fab teams to optimize process uniformity and manufacturability
  • Partner with reliability engineers to meet stringent reliability requirements
  • Lead root cause investigations for device/process/reliability/yield improvements
  • Benchmark competitor technologies and set next-generation GaN targets
  • Interface with design and applications teams for technology-design co-optimization

What We’re Looking For

  • MS or Ph.D. in Physics, Electronics, Chemistry, or related field
  • 10–15 years of experience in GaN technology development
  • Deep understanding of III-V epitaxy, front-end process integration, and reliability physics
  • Experience with DOE, characterization, and failure analysis
  • Familiarity with RF power applications is a strong plus

Preferred Skills

  • Problem-solving for complex integration challenges
  • Ability to lead multidisciplinary teams and drive results
  • Strong communication, presentation, and reporting skills

Why Join Us?

  • Work on cutting-edge GaN technology for next-gen RF power solutions
  • Collaborate with top-tier teams and research partners in a fast-paced environment

Interested? Apply now or reach out for more details!
 

#LI-JD1
James Dees Managing Consultant

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