Global Principal Program Manager, Tool Install - Semiconductors

9529
  • Competitive
  • Idaho, United States
  • Semiconductor
  • Permanent
Global Facilities Principal Program Manager, Tool Install - Semiconductors

We are working with a world-leading semiconductor technology company to identify a Principal Program Manager for their Global Facilities Tool Installation team. This is one of the most senior and strategically significant programme management roles within the organisation — sitting at the intersection of global facilities engineering, greenfield fab construction, and manufacturing operations.
The Global Facilities Tool Installation team leads the planning, development, construction, and operation of a worldwide manufacturing network. This team drives major global programmes that integrate engineering innovation, sustainability, and operational excellence to enable advanced semiconductor manufacturing at scale.
This is a principal-level role designed for a highly experienced professional with a strong facilities and greenfield construction background who thrives in complex, fast-paced environments and excels at collaboration, data-driven decision-making, and continuous improvement. If you have led Tool Installation programmes at a major semiconductor fab or tier-1 contractor, this is a rare opportunity to take that experience to a global stage.
Key Responsibilities
  • Lead U.S. Facilities Tool Installation efforts for new fab startups and greenfield expansions, including planning and development of Tool Install User Requirement Specifications (TI-URS).
  • Partner with Global Procurement and site teams on TI RFPs, supporting contracting strategies, bid evaluations, cost modelling, and execution timelines.
  • Ensure global project readiness by coordinating material planning, labour strategies, construction interfaces, and risk identification and resolution.
  • Develop and maintain installation benchmarks to identify opportunities for cycle-time reduction and critical path optimisation.
  • Define and implement global TI strategies and transformation roadmaps, including standardisation and digital enablement initiatives.
  • Deliver executive-level reporting, analytics, and insights to support decision-making and risk management across senior leadership.
  • Support cost visibility, budgeting processes, and adoption of project management systems to ensure data consistency and alignment across sites.
  • Minimum Qualifications
  • Bachelor's or Master's degree in Engineering, Construction Management, Project Management, or a related field.
  • 10+ years of experience in semiconductor wafer fabrication facilities, preferably in 300mm (12") environments.
  • Strong knowledge of facilities tool installation, cleanroom operations, and system integration with manufacturing equipment.
  • Ability to collaborate globally, including flexibility to work across time zones and travel up to 10%.
  • Preferred Qualifications
  • Experience working in global, multi-functional environments with suppliers, contractors, and senior stakeholders.
  • Familiarity with tools such as AutoCAD, Revit, Power BI, Tableau, or similar engineering and analytics platforms.
  • Strong communication, organisational, and stakeholder management skills.
  • Demonstrated ability to manage multiple priorities independently and drive continuous improvement initiatives.
  • Why This Role?
  • Principal-level scope with genuine global reach — your strategies and BKMs will be implemented across international fab sites, not just one location.
  • Work on one of the most ambitious semiconductor greenfield expansion programmes underway in the United States today.
  • Rare opportunity to move from execution-level TI management into a strategic, cross-functional leadership role with executive visibility.
  • Highly competitive compensation package at the top of the market for principal-level programme management talent.
  • Collaborative culture with a lean, high-performing team where your contribution is visible and valued.
 
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