Packaging Engineer - Leaded

Job Title: Packaging Engineer

Job Overview:
Our client is seeking an experienced and highly skilled Packaging Engineer to join their global team. This role offers an exciting opportunity to work in a collaborative environment with top-tier engineers, driving the innovation and optimization of semiconductor packaging solutions. As a Packaging Engineer, you will contribute to high-impact projects while continually developing your expertise in a dynamic industry.

Key Responsibilities:

• Process Optimization: Optimize and define robust, high-speed process parameters for component attachment, stack-up, and molding technologies (including transfer and compression molding).

• Manufacturing Process Definition: Develop and streamline simplified manufacturing process sequences for various component attachment methods.

• New Product Development: Lead the execution of multiple new product projects from initiation through product prototyping, characterization, learning cycles, qualifications, and final release (RTM), ensuring thorough documentation throughout the process.

• Collaboration with Operations: Work closely with factory operations teams to ensure that manufacturing targets, quality standards, and cost goals are met.

• Technology Roadmap Execution: Partner with global platform and emerging technology teams to implement differentiated technology roadmaps and build process capabilities that address future needs.

• Industry Competitiveness: Help maintain the competitiveness of packaging solutions by integrating the latest industry technologies into high-volume manufacturing environments.

Minimum Qualifications:

• Education: Bachelor’s degree in Mechanical Engineering, Physics, Material Science, or a related field.

• Experience: At least 8 years of experience in the semiconductor industry, specifically in packaging engineering.

• Expertise: Advanced knowledge in molding processes, with secondary expertise in trim & form (TNF) process development.

• Package Layer Design: Strong understanding of package layer design, including structural configuration, material selection, and process flow design.

• Experience with SMT and Modules: Hands-on experience with Surface-Mount Technology (SMT) and familiarity with packaging modules such as TOLL, TOLT, and GaN.

• Process Optimization Skills: Practical experience in machine operation, material selection, process optimization, and yield improvement.

Preferred Qualifications:

• Package Singulation: Knowledge of package singulation processes is a plus.

• Global Team Engagement: Ability to collaborate with geographically diverse teams and lead strategic initiatives to drive complex technology roadmaps.

• EOL Process Knowledge: Familiarity with IC packaging End-of-Line (EOL) processes and understanding of Design for Manufacturability (DFM) constraints.

Location: Malaysia

This is an exciting opportunity for a highly skilled Packaging Engineer to join a leading company in the semiconductor industry. If you are passionate about advancing packaging technologies and have a track record of delivering high-quality results, we invite you to apply.