Product Management & Business Unit Leader

Advanced Semiconductor Packaging

Location: Taipei, Taiwan

A Leadership Opportunity at the Heart of Semiconductor Innovation

The semiconductor industry is entering one of the most exciting periods in its history. As demand for AI, high-performance computing, advanced networking and next-generation devices continues to accelerate, advanced packaging has become one of the industry's most critical areas of innovation.

Our client is a well-established technology organisation with a strong presence in semiconductor manufacturing and advanced packaging solutions. Working with many of the world's leading semiconductor companies, they are investing heavily in the technologies that will define the next generation of device performance and integration.

As part of this growth, they are looking to appoint a Product Management/Business Unit Leader to lead a strategically important Advanced Semiconductor Packaging division based in Taipei.

This is a rare opportunity to step into a role that combines technology leadership, commercial ownership and market influence. You'll have responsibility for a business generating approximately $50 million in annual revenue, lead a team of around 25 professionals, and play a key role in shaping product strategy, customer engagement and future growth.

For someone who enjoys operating at the intersection of technology, customers and business strategy, this is an opportunity to make a genuine impact in a market that is evolving at an extraordinary pace.

The Role

Reporting to senior leadership, you will take overall responsibility for the Advanced Semiconductor Packaging business, driving both strategic direction and day-to-day performance.

You'll work closely with customers, engineering teams and commercial stakeholders to ensure the organisation remains well-positioned to capitalise on emerging opportunities across advanced packaging technologies. From defining product roadmaps and identifying new growth areas to building executive-level customer relationships and developing high-performing teams, this role offers broad exposure and significant influence.

Success in this position will require a combination of technical credibility, commercial acumen and strong leadership capability. You'll be comfortable discussing advanced packaging challenges with engineers one day and presenting business strategy and growth plans to executive stakeholders the next.

Key Responsibilities

Business Leadership

• Lead a business unit with responsibility for revenue growth, profitability and overall performance.

• Develop and execute long-term business strategies aligned to market opportunities and customer needs.

• Identify new growth opportunities, market segments and technology adjacencies.

• Provide regular performance updates, forecasts and strategic recommendations to senior leadership.

• Ensure resources and investments are aligned to the organisation's highest-priority objectives.

Product Strategy & Market Development

• Own the product strategy and roadmap for advanced semiconductor packaging solutions.

• Monitor technology trends, customer requirements and competitive developments across the industry.

• Partner with engineering and R&D teams to translate market needs into product development priorities.

• Oversee the full product lifecycle, from concept through commercial launch and ongoing portfolio management.

• Drive value-based positioning and pricing strategies that support sustainable growth.

Customer & Industry Engagement

• Build strong relationships with leading semiconductor manufacturers, OSATs, IDMs and emerging technology companies across the region.

• Act as a trusted partner to customers, supporting strategic technology discussions and long-term collaboration initiatives.

• Represent the organisation at industry events, conferences and customer engagements.

• Work closely with customers to understand future requirements and ensure solutions remain aligned to evolving market needs.

Leadership & Team Development

• Lead, mentor and develop a multidisciplinary team of approximately 25 professionals.

• Create an environment that encourages collaboration, innovation and continuous improvement.

• Support talent development and succession planning across the organisation.

• Foster strong partnerships with global engineering, operations and commercial teams.

About You

We're interested in speaking with individuals who combine a strong technical foundation in semiconductor packaging with proven commercial and leadership experience.

You are likely to have:

• Significant experience within semiconductor equipment, advanced packaging or related technology sectors.

• A strong understanding of advanced packaging technologies and manufacturing processes.

• Experience leading product management, business units, technical marketing or commercial organisations.

• Demonstrated success managing revenue, profitability and business growth objectives.

• A track record of building and leading high-performing teams.

• Established relationships within the semiconductor ecosystem across Taiwan and the wider Asia-Pacific region.

• The confidence and credibility to engage effectively with both technical and executive stakeholders.

• A degree in Engineering, Materials Science or a related discipline, with postgraduate qualifications viewed favourably.

Technical Areas of Interest

Experience in any of the following areas would be particularly valuable:

• Flip Chip assembly

• Wafer-Level Packaging (WLP/WLCSP)

• Fan-Out Packaging (FOWLP/FOPLP)

• 2.5D and 3D integration

• Chiplet architectures and heterogeneous integration

• Thermocompression and hybrid bonding

• Die attach and encapsulation processes

• Inspection, metrology and process control technologies

What's on Offer

Alongside a highly competitive compensation package, this opportunity offers the chance to take a visible leadership role within a growing and strategically important area of the semiconductor industry.

You'll have the autonomy to shape business strategy, influence product direction, develop customer partnerships and lead a talented team, all while operating at the forefront of one of technology's most dynamic and rapidly evolving markets.