Product Management & Business Unit Leader

Advanced Semiconductor Packaging

Location: Upstate New York, New York (Relocation Support Available)

Lead a Growing Business at the Forefront of Advanced Semiconductor Packaging

Advanced packaging has become one of the most important areas of innovation within the semiconductor industry. As AI, high-performance computing, advanced networking and next-generation electronics continue to drive demand for increased performance and integration, the technologies that enable these advances are becoming more critical than ever.

Our client is an established technology organisation with a strong reputation within semiconductor manufacturing and advanced packaging solutions. Working closely with many of the industry's leading semiconductor companies, the business continues to invest in new technologies, product development and market expansion to support the evolving needs of customers worldwide.

As part of this growth, an opportunity has arisen for an experienced Product Management & Business Unit Leader to take ownership of a strategically important Advanced Semiconductor Packaging division based in New York.

This is a highly visible leadership position offering full responsibility for a business generating approximately $25 million in annual revenue, alongside leadership of a team of around 20 professionals. The successful candidate will play a pivotal role in shaping product strategy, driving commercial performance and strengthening customer relationships within one of the industry's most dynamic markets.

For individuals who enjoy combining technology, business leadership and customer engagement, this represents an opportunity to make a meaningful impact while helping shape the future direction of a growing business.

The Opportunity

Reporting directly to senior leadership, you will oversee the strategic and commercial success of the Advanced Semiconductor Packaging business unit.

You will be responsible for setting direction, driving growth and ensuring the business remains closely aligned with evolving customer requirements and market trends. Working across product management, engineering, sales and operations, you will play a central role in developing innovative solutions and bringing them successfully to market.

The position requires a unique blend of technical expertise, commercial judgement and leadership capability. You will be equally comfortable discussing complex packaging technologies with engineering teams as you are presenting growth strategies and business performance updates to executive stakeholders.

Key Responsibilities

Business Unit Leadership

• Lead the overall performance of the business unit with responsibility for revenue growth, profitability and strategic execution.

• Develop and implement business plans that support long-term growth objectives.

• Identify new market opportunities, customer segments and strategic partnerships.

• Provide regular business reviews, forecasts and strategic recommendations to senior leadership.

• Ensure resources and investments are aligned to maximise commercial and operational performance.

Product Strategy & Portfolio Management

• Own the product strategy and roadmap for advanced semiconductor packaging solutions.

• Lead the full product lifecycle, from concept development and market assessment through to commercial launch and portfolio optimisation.

• Partner closely with engineering, operations and commercial teams to translate customer requirements into successful product offerings.

• Monitor technology trends, competitive activity and customer roadmaps to ensure continued market relevance.

• Develop pricing and positioning strategies that support both customer value and sustainable profitability.

• Act as the internal advocate for customer requirements and emerging market needs.

Customer & Market Engagement

• Build and maintain senior-level relationships with semiconductor manufacturers, OSATs, IDMs and fabless organisations.

• Serve as a trusted partner to customers, supporting strategic technology discussions and long-term development initiatives.

• Support major commercial opportunities, customer presentations and executive-level engagements.

• Represent the business at industry events, conferences and customer meetings.

• Maintain a strong understanding of competitive dynamics and evolving market requirements.

Leadership & Team Development

• Lead, mentor and develop a team of approximately 20 professionals across product management, sales support and business operations.

• Create a culture focused on accountability, collaboration, innovation and continuous improvement.

• Establish clear objectives and performance expectations while supporting ongoing development and career progression.

• Identify and develop future leaders within the organisation.

• Foster strong cross-functional collaboration across engineering, operations and commercial teams.

About You

We are interested in speaking with individuals who bring a combination of technical depth, commercial leadership experience and a genuine passion for semiconductor innovation.

You are likely to have:

• Significant experience within semiconductor equipment, advanced packaging, semiconductor manufacturing or a related technology sector.

• Strong product management and business leadership experience, including ownership of revenue growth and profitability objectives.

• A proven track record of leading multidisciplinary teams within complex, fast-paced organisations.

• Deep understanding of advanced semiconductor packaging technologies and manufacturing processes.

• Experience developing product roadmaps and bringing technically sophisticated products to market.

• Strong commercial instincts with the ability to convert market insights into business results.

• Excellent communication and stakeholder management skills, including experience engaging with senior executives and customers.

• A Bachelor's degree in Engineering, Materials Science or a related technical discipline, with postgraduate qualifications viewed favourably.

Technical Areas of Interest

Experience across one or more of the following areas would be highly advantageous:

• Flip Chip assembly technologies

• Wafer-Level Packaging (WLP/WLCSP)

• Fan-Out Packaging (FOWLP/FOPLP)

• 2.5D and 3D integration architectures

• Chiplet-based heterogeneous integration

• Thermocompression and hybrid bonding

• Die attach and advanced assembly processes

• Semiconductor process control, inspection and metrology solutions

What Success Looks Like

The successful individual will bring the technical credibility to engage confidently with customers and engineering teams, the commercial mindset to drive growth and profitability, and the leadership capability to build and develop a high-performing organisation.

This role offers the opportunity to influence strategy, shape product direction, strengthen customer partnerships and lead a growing business operating at the centre of some of the semiconductor industry's most exciting developments.

What's on Offer

A highly competitive executive compensation package is available, including:

• Competitive base salary

• Performance-based annual bonus

• Long-term incentive opportunities

• Comprehensive healthcare and insurance benefits

• 401(k) retirement programme with company contribution

• Generous paid time off

• Relocation support where required

• Executive coaching and professional development opportunities

This is an exceptional opportunity for a commercially minded semiconductor leader looking to take ownership of a growing business and play a key role in the future of advanced semiconductor packaging.